IPM consists of a high-speed, low-power IGBT chip and a preferred gate level drive and protection circuit, as shown in Figure 1. Among them, IGBT is a combination of GTR and MOSFET, and the MOSFET drives the GTR, so IGBT has the advantages of both.
IPM can be divided into four categories according to the internal power circuit configuration: Type H (internal package of one IGBT), type D (internal package of two IGBT), type C (internal package of six IGBT) and type R (internal package of seven IGBT). The low-power IPM uses a multi-layer epoxy insulation system, and the medium-power IPM uses ceramic insulation.